While I would like to share Nisene Technology Group’s experience at the recent SMTA (Surface Mount Technology Association) event, I would also like to introduce myself to all readers. I am Erik Jordan, the newest addition to the Nisene Technology Group family. I was hired on as the National Sales Representative as well as assisting in the marketing of Nisene and its products. Read the rest of this entry »
After a much-anticipated relocation of Nisene’s facility, we have now completely upgraded our gaskets and fixtures manufacturing room. As you’ll see in the picture below, we now have a bank of brand new, high-end computers running state-of-the art CNC milling machines. The customized enclosures were designed to reduce noise in the manufacturing room, as well as keep the computers separate from the dust and rubber or metallic burrs that the milling machines expel whilst creating a fixture.
Check out The New Setup.
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In addition to now having the highest-tech setup, now that we have four units running at all times, we can ensure the fastest turnaround for custom fixtures ever provided for our customers. We look forward to utilizing the new setup to its fullest capabilities.
Be sure to check out Nisene for all your decapsulation and delayering needs.
Lately, more and more samples that I receive contain copper bond wires. This alway poses a problem since nitric acid eats away at copper wires, but nitric is a great choice for removing plastic packaging.
When posed with the challenge of maintaining the integrity of the copper bond wires, I usually start with a mix of three parts nitric and 1 part sulfuric at about 35 degrees. This method always takes a long time, but good things come those who wait, and it often yields pretty desirable results. Recently, I’ve been playing with equal parts nitric and sulfuric at around 80 degrees, and I’ve been fairly pleased with what I see. It doesn’t take quite as long, and the wires still look pretty good.
I had a really interesting (relatively speaking) decapsulation challenge with a sample today. It was a fairly normal looking BGA-type sample upon first glance; however, I quickly realized after my first etch that I was up against a greater challenge than what a typical ball grid array usually poses. Read the rest of this entry »
Hey everyone, my name is Greg and I’m the OmniEtch Applications Engineer here at NTG. I use the OmniEtch to deprocess all sorts of layers on all sorts of samples and, with the help of one of our users at ASI, I recently developed a new recipe for the planar removal of aluminum from ICs.
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Nisene will soon be implementing a new LCD for its JetEtch decapsulation system. Instead of the drab, funky green screen with black text, we’ll be going with a blue screen with white text for an ultra-chic look! Granted, I use the term “chic” loosely, as you have to take it in context — a JetEtch decapsulation system can only look so sexy. Simply put, it’ll look a lot better with the new upgraded screen. In addition to being more aesthetically appealing than before, it’ll be more viewable from more angles than our last screen; and in any lighting condition.
Another aesthetic change we’re making is Read the rest of this entry »
A wee bit about myself:
My name is Nate, and I work in the applications department at Nisene Technology Group. My primary task here is to use our JetEtch system to decapsulate IC samples from companies around the world. This in turn will prove to the company in question that our machine is superior to the conventional ‘hot-plate and dropper’ technique. I’ve opened a huge variety of packages, including but not limited to DIP/SIP, TO, QFN, QFP, and BGAs of all shapes and sizes, even some with copper bond wires. I’ve also designed a fair amount of accessories, many of them custom built, for use with the JetEtch.
Currently, I am etching a TO-220 sample Read the rest of this entry »
Happy Thanksgiving to all!
