JetEtch Product Line
The Industry-Leading Decapsulation Systems.
Nisene Technology Group has raised the bar with the new line of automated Chemical IC Decapsulation systems, the JetEtch, CuProtect and TotalProtect. By offering three distinct IC decap systems with a single foundational platform Nisene can meet the specific needs of all customers seeking precision decapsulation for the types of ICs they are required to decap and perform the necessary failure analysis. The safety and performance features are unparalleled in the industry.
Features Include:
What does it do?
The JetEtch decapsulation system takes an integrated circuit encapsulated in mold compound and removes it using a user-specified chemical solution. The process of mold compound removal is called “decapsulation” and is often referred-to as “decapping,” “Jet-Etching,” and similar. The results of this process can be used in a number of ways, but are most commonly seen in semiconductor failure analysis and counterfeit protection during the verification process. Without exposing the die in an integrated circuit, verifying a part’s authenticity is virtually impossible. Die exposure is also critical to the failure analysis industry, as a die in this state lends itself best to a wide number of types of tests.
Take me for a spin!
Check out the 3D spinner. Use the arrows to expand to full-screen.
Decap Examples
Here are just a few of our favorites!
It’s a Patented Micrometering Pump.
It’s a Revolutionary Heat Exchanger.
The heat exchanger in the JetEtch systems are unlike any other decapsulation system. Designed with the utmost safety, efficiency, durability ,and accuracy in mind. Nisene heat exchangers incorporate multiple stainless steel heating cartridges, over-temperature protection, precision temperature
sensors, and multiple industrial thermoelectric modules for our TotalProtect model allowing for sub-ambient temperature etching.
It’s Safe.
The JetEtch Decapsulation systems are the safest decapsulation systems
available. Featuring a host of safety attributes that go overlooked in other manufacturers’ models, Nisene Technology Group prides itself on what it offers in the JetEtch systems in regards to user safety features. Below we have a few examples:
Waste Diversion.
Automatically separate your waste acids — ALWAYS!
The waste diversion process in the JetEtch systems are and will always be a staple in the safety standards that go into each system we manufacture. A pneumatically controlled waste diversion valve assembly works solely on air pressure and as such is virtually fail-proof. All of your nitric waste acid goes into the nitric waste bottle, and the sulfuric waste acid goes in the sulfuric waste acid bottle.
Do not be fooled by competing systems that offer singular waste bottle setups, where cooling of waste acids occurs prior to the dispension into the waste bottle. Systems like this rely on sensitive electronic components that are susceptible to failure — the very nature of this sort of waste-handling assembly is fraught with contradictions to user safety. To put it simply:
Never mix acids if you don’t have to! This is one of many safety principles in which Nisene believes strongly.
Dual Waste Bottles / Bottle Box Assembly.
The JetEtch systems have a unique dual waste bottle setup that is an extension of its waste diversion process explained above. Each 500 mL bottle (standard sizing) resides in its own storage unit that has a volume of over 600 mL. This means that no leak or bottle crack will get out of its cubby and mix with other acids or acid waste. This is THE SAFEST possible user experience. Look at the difference between the Nisene bottle box assembly on the left, and a competing system’s offering on the right. One is safe; the other is not:
As with the rest of the chassis, the JetEtch systems use only the highest-grade plastics for its bottle box assembly. This means that no matter what kind of punishment the JetEtch system encounters, it will endure for many years. Only the best from Nisene Technology Group.
Pneumatic Cover Arm / Process Cover.
The JetEtch systems have the safest process etching chamber containment available. Our cover arm assembly is controlled by pneumatics and is hands-down THE SAFEST possible way to seal an etch chamber. This is an assembly that is constructed of the highest grade alloys, plastics, and Teflon that will never wear out over time — a big problem on less sophisticated etching units. Other systems rely on manual closure mechanisms that are not controlled by software, meaning as a user you have to actually close and open the cover on your own! Exposed process cover arm joints and hinges seen on competing systems are highly susceptible to corrosion, to say nothing of creating additional pinch points where one’s fingers or lab attire might get caught! Not so with the Nisene models.
At Nisene, we believe that minimal user intervention with our equipment to initiate and halt an etch sequence offers the highest safety to a user and their surroundings. The largest semiconductor manufacturers in the industry — who have the most stringent safety policies out there — couldn’t agree more.
Its Software is Advanced.
With a host of features not found on competing equipment, Nisene offers users of its decapsulation equipment the most advanced programming software available. A few things that put our system head and shoulders above the others:
- Flexible Etch Time: 1 – 1800 seconds (adjustable in one-second increments)
- Acid Delivery Methods: Pulse and Vortex
- Wide Range of Etchant Acid Volumes: .1, .2, .5, 1-10mL/min for Pulse; 1-6mL/min for Vortex
- Thirteen (13) Mixed-acid Ratios
- One-hundred (100) Etch Recipe Storage
- Multiple Post-etch Rinse Options: 1-20 seconds (adjustable in one-second increments) for Nitric and Sulfuric; or No Rinse
- Wide Temperature Range: 20°C – 250°C **
- Heat-up Time Range: 25 – 280 seconds (adjustable in one-second increments)
- Full specs below ⤵
It’s Intuitive.
The JetEtch systems are very easy to operate. With its simple, ergonomic and functional keypad and front panel design, it offers the simplest and most intuitive user interface of any decapsulation system. Backed by more than Five decades of expertise in engineering equipment for use in multiple industries and by a wide variety of personnel, our experience and knowledge in this field has no equal.
The built-in electronic front panel assembly offers many advantages to other models you might find in the field that feature a removable and/or touch screen keypad. Having a contiguous input assembly unit minimizes the need for external connections, which are susceptible to corrosion and failure; and a removable or tethered keypad assembly can introduce contaminated components to areas of your facility that aren’t geared for decapsulation safety. Removing the keypad and stylus that you have handled with your gloves while creating a recipe from your etching area to outside of the fume hood or lab area is an unsafe procedure. You won’t find anything like that on our systems.
Dull and drab screens are hard to read. The JetEtch Systems have a high-contrast backlit LCD with eye-popping blue menus and white text that is legible in the most challenging lighting situations and is easy to read from any angle.
Our screen is very easy to read.
Technology: It’s Our Middle Name.
Nisene Technology Group is constantly innovating and redesigning its decapsulation equipment to meet the demands of the industries we serve. The JetEtch Systems are no exception. The integrated circuit failure analysis and distribution industries are faced with difficult decapsulation challenges with the constantly-changing package construction processes. As an analyst, you may be faced with any number of sample types.
Copper Wires? Check.
Aluminum Wires? Check.
Gold Wires? Check.
The JetEtch Systems can safely etch virtually any sample that you can put into its etch chamber. With 10 etch parameters at your disposal for sample decap processing, the number of recipes you can write is in the thousands. This variety allows users to have the ultimate flexibility and fine-tuning capabilities necessary for the most complex package designs — including samples with wires and other internal components made of gold, aluminum, and copper. Since the JetEtch can store 100 different recipes in its nonvolatile memory EEPROM chip, once you save a recipe into the system it is ready for recall — whether that’s for tomorrow’s etching or for a sample run coming up next year. When you lock-in a recipe, it’s there forever until you change it again.
Protect Your Copper Wires
with the CuProtect and TotalProtect
The JetEtch Systems are now available with in two new configurations that are shaking up the industry: The CuProtect and the TotalProtect.
The JetEtch Systems with the CuProtect option is changing the game with its revolutionary method for etching samples with copper wires by utilizing a patented bias voltage process. Click here to read more about the CuProtect.
The TotalProtect model features the bias voltage process found in the CuProtect, but also includes a special sub-ambient cooling option that offers the user the most advanced set of copper wire protection options available. It’s the total solution. Click here to read more about the TotalProtect.
It’s Affordable.
With the status of the global economy in mind, Nisene’s JetEtch Systems are in line with the competition — despite being light years ahead of what anyone else is offering in terms of its technological advantages. If pricing is an issue and you find that a competitor’s pricing is more favorable to your budget, Nisene Technology Group promises to meet or beat anyone else’s quotation to you on comparable equipment. Just show us the quote and we’ll match it — and then some! With the most experienced and longest-lasting decapsulation system manufacturers matching the pricing offered by companies who have been in business for less than 10 years, the choice is easy.
The Warranty: It’s Long.
The JetEtch Systems comes with the most comprehensive decapsulation system warranty on the planet. Just look at what we’re offering! *
- Two-year Comprehensive System Warranty — Everything in the system is covered for two years minimum (excluding consumables).
- Five-year Pump Warranty — The industry-leading patented pump is covered under warranty for five years from date of purchase.
- Three-year Heat Exchanger Warranty — The heat exchanger assembly receives three years of warranty coverage.
- Extended Warranty — All current JetEtch Pro, CuProtect and TotalProtect are eligible for our extended warranty option.
JetEtch Product Line Specs
Dimensions
Etcher unit (mm/in) 290 h x 290 w x 419 d / 11.5 h x 11.5 w x 16.5 d
Bottle container, each unit (mm/in) 230 h x 110 w x 110 d / 9 h x 4.25 w x 4.25 d
Weight (kg/lbs)
17 / 38 (excluding bottle container and accessories)
Power
350 W @ 95 – 130 VAC or 350 W @ 210 – 250 VAC
CDA/N2 Requirements
CDA 4.2 kg/cm2 / 60 –100 psi
Nitrogen supply 2.8 lpm / 0.1 cfm
Etchants Available
Etchant volume: .1, .2, .5, 1-10mL/min for Pulse; 1-6mL/min for Vortex
Fuming nitric acid
Fuming sulfuric acid
Sulfuric acid (concentrated reagent grade)
Nitric : sulfuric acid mix 6:1, 5:1, 4:1, 3:1
Sulfuric : nitric acid mix 6:1, 5:1, 4:1, 3:1
Temperature Ranges
JetEtch Pro and CuProtect
Nitric acid (°C) 20 – 90
Sulfuric acid (°C) 20 – 250
Mixed acids (°C) 20 – 100
JetEtch TotalProtect
Nitric acid (°C) 5 – 90
Sulfuric acid (°C) 5 – 150
Mixed acids (°C) 5 – 100
(mixed etchant range automatically calibrated to ratio selected)
Etching Time & Modality
(user selectable)
1 – 1800 seconds in 1.0-second increments
Pulse Etch mode, Vortex Etch mode
Program capacity: 100, user-defined, in nonvolatile memory
JetEtch CuProtect and TotalProtect
Bias selection: 0.0 – 20 V in 0.1-V increments
JetEtch TotalProtect
1 – 3600 seconds in 1.0-second increments
Program Daisy-chaining: combine multiple programs in succession without interrupting the etch process
Heat-up Time
(user selectable)
0 – 120 seconds in 1.0-second increments
Rinse Options
Nitric acid, sulfuric acid, no rinse
Reservoirs
500-mL or 1-litre bottles
33/38/40/45-mm cap sizes
4 bottles standard: 2 acid, 2 waste
Certifications
CE certification, SEMI S-2-93, SEMI S-2-2000
Accessories
All JetEtch Pro systems are supplied with a standard basic Accessory Kit. A wide range of Accessory Kits and custom-designed Monolithic Gaskets is available (contact Nisene for details).
Complete List of Accessory Kits
0300601 — DIP/SIP
0300602 — PLCC
0300603 — SOIC
0300604 — QFP
0300605 — BGA
0300606 — Die-Down BGA
0300609 — QFN/MLP
0300612 — Universal Accessory Kit
Installation
Installation in chemical fume hood required. 0.5 meters/sec minimum flow rate (100 surface ft/min).
Nisene Technology Group, Inc. Defining Decapsulation Again
* = Warranty coverage not available in all areas. Warranty terms listed here are for systems sold and operated in the Contiguous United States only. International warranty offers may differ by territory. Please contact your local distributor for international warranty information.
