Counterfeit Protection

Nisene Technology Group is Your Source for Counterfeit Protection Products

Your quest for integrated circuit inspection starts and ends with Nisene Technology Group, the world leader in counterfeit detection. With our available lineup of products designed for deeper-level sample processing — in particular, affording our end users with the most desire goal: visual inspection of the die surface — Nisene has every chip distributor’s needs covered.

 Why Nisene?

The JetEtch family of decapsulation systems by Nisene Technology Group is the most widely used decap system for failure analysis and counterfeit detection. The biggest players in these major industries use Nisene product in all of their labs, including United States and abroad. Anywhere on Earth that decap is performed, a Nisene decap system is there. Have a look at our testimonials page to read just a few examples of satisfied customers from various industries.

Nisene is also a main contributor to SAE AS6081 and SAE AS6171 counterfeit detection standards! We have published work with the following programs (among others):

  • Components Technology Institute (CTI)
  • ERAI
  • SMTA
  • ISTFA
  • CHASE/UCONN
  • IDEA
  • SAE
  • …and many more…

How Can Nisene Help Your Company?

By providing access to the surface of the die for complete visual inspection, the decapsulation process enables the most comprehensive form of testing available. X-ray, lead testing, and other inspection technologies and gimmicks only tell part of the story. Have a look at some samples below.

Double Ball Bonds:

Etch Example - Double Ball Bonds
Etch Example - Double Ball Bonds
Etch Example - Double Ball Bonds

Die Marking:

Etch Example - Die Marking
Etch Example - Die Marking
Etch Example - Die Marking

Bond Pads:

Etch Example - Bond Pads
Etch Example - Bond Pads
Etch Example - Bond Pads

Before and After:

Etch Example (Before)
Before
Etch Example (After)
After
PlayPause
Full screenExit full screen
Slider

These results are possible only with decapsulation technology!

Which System is Right for You?

Choose from our JetEtch Pro, JetEtch Pro CuProtect, or JetEtch Pro TotalProtect models for decapsulation of integrated circuits with plastic and similar mold compounds; or our CERDIP Opener and Can Opener systems for hermetically sealed devices more frequently found in aerospace and military applications. If you’re not sure which product is right for you, simply contact us and we will get you squared away.

Ask about our OEM Discount!

OEMs — you’ve come to the right place. Click here to find out more information that Nisene offers to OEMs such as yourself.

Exactly how Does it Work?

See the JetEtch in Action:

Nisene Technology Group, Inc. Defining Decapsulation Again